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Back Grind Tape
Tape for Semiconductor
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Ace Industries Co., Ltd.
[Korea]
Address:
40 Neukhyun-ri, Chowol-myen, Gwangju-si Gyeonggi-do 464-861 Korea
Phone:
82-31-7618415
Contact name:
Yonggook An , Director
Tape for Semiconductor
Back Grind Tape
Click to enlarge image
Model Number
AP130-SC, AP130-SD, AP200-SC, AU130-SC
Parts Item
AP130-SC
Series
AP130-SD Series
AP200-SC Series
AU130-SC
Series
Structure & Materials
Base Film
POLY-OLEFIN
POLY-OLEFIN
POLY-OLEFIN
POLY-OLEFIN
Adhesive
ACRYL
ACRYL
ACRYL
ACRYL
Protective Film
PET
PET
PET
PET
Thickness
(um)
Total
B/F
130
110
130
100
200
180
130
110
Adh
20
20
20
20
Protective Film
40
40
40
40
Adhesion
(gf/25mm)
Before UV
130
150
130
300
After UV
Less than 30
Application
Non-UV
Non-UV
Non-UV
UV
* REMARK : Film Thickness & Adhesion variation depends on Customer's request & Quantity.
Test Conditions :
Test Method : JIS Z 0237 / KS A 1107
Sample : 25mm x 350mm, 4ea
Substrate : Sus Plate (#280 polished)
Laminating Pressure : 1cycle with 2kg Rubber Roller
Remove Speed : 300mm/min
Peeling Angle : 180C
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